Diamond Polishing Film-1µm for use in Fiber Optic (Ferrule)
Grinding and Polishing
Product specification:
New Version:
66XC,66HPL,66HPX, 66P
4.3"(110mm),5"(127mm) Disc
Product Type
Diamond Lapping Film:
Particle Size:0.5µm, 1µm, 3µm , 6µm , 9µm
For Epoxy Removal
46P Silicon Cabide 5"(127mm) Disc
Product Type:
SiC Lapping Film
SiC 15µm and SiC 30µm
This line of products integrates high quality Diamond and other related polishing particles, selected for use in high-precision coating methods, evenly spread on a 3 mil PET backing.
The high hardness ceramic ferrule grinding process can effectively remove marks, blemishes and traces of adhesive, as well as notably improve surface loading. At the same time, our product possesses highly effective polishing strength, with the ability to effectively reduce the amount of time and resources required for grinding.
In addition, our products possess both high wear-resistance and long lifespan, minimizing the number of discs used and increasing overall production capacity while reducing net cost.
Matching the use of SiC lapping film and SiO2 polishing discs, our customers will be able to optimize the process of manufacturing ceramic fiber optic cables and employ a high capacity, high quality polishing process.
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